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INTEGRATED CIRCUITS
DATA SHEET
TDA8716 8-bit high-speed analog-to-digital converter
Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 1996 Aug 26
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
FEATURES * 8-bit resolution * Sampling rate up to 120 MHz * ECL (10 K family) compatible digital inputs and outputs * Overflow/Underflow output * Low power dissipation * Low input capacitance (13 pF typ.). APPLICATIONS * High speed analog-to-digital convertion * Video signal digitizing * Radar pulse analysis * Transient signal analysis * High energy physics research * Medical systems * Industrial instrumentation. QUICK REFERENCE DATA Measured over full voltage and temperature ranges, unless otherwise specified. SYMBOL VEEA VEED IEEA IEED IEEO VRB VRT ILE DLE EB fCLK Ptot PARAMETER analog supply voltage digital supply voltage analog supply current digital supply current output supply current reference voltage BOTTOM reference voltage TOP DC integral linearity error DC differential linearity error effective bit maximum clock frequency total power dissipation excluding load see Fig.8 see Fig.9 fi = 20 MHz; fCLK = 100 MHz RL = 2.2 k CONDITIONS MIN. -5.45 -5.45 - - - - - - - - 120 - TYP. -5.2 -5.2 50 100 20 -3.130 -1.870 0.5 0.25 7 - 780 GENERAL DESCRIPTION
TDA8716
The TDA8716 is an 8-bit high-speed Analog-to-Digital Converter (ADC) designed for HDTV and professional applications. The device converts the analog input signal into 8-bit binary coded digital words at a sampling rate of 120 MHz. All digital outputs are ECL compatible.
MAX. -4.95 -4.95 55 110 25 - - 1 0.45 - - 900
UNIT V V mA mA mA V V LSB LSB bits MHz mW
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8716 TDA8716T DIP24 SO32L DESCRIPTION plastic dual in-line package; 24 leads (600 mil) plastic small outline package; 32 leads; body width 7.5 mm VERSION SOT101-1 SOT287-1
1996 Aug 26
2
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
BLOCK DIAGRAM
TDA8716
handbook, full pagewidth
analog input 8
voltage reference top voltage reference middle voltage reference bottom
10 9 6 LSB ANALOG PROCESSING folding and interpolation MSB ANALOG PROCESSING
7 11
analog ground
5
analog negative supply voltage (- 5.2 V)
SAMPLE LATCHES
DIGITAL PROCESSING 1 CLOCK BUFFER LATCHES 13 24 3 12 LSB BINARY ENCODER 6 OUTPUT LATCHES MSB BINARY ENCODER 3 4 digital ground digital negative supply voltage (- 5.2 V) two's complement output select
CLK input
CLK input
2
TDA8716
ECL BUFFERS 14 15 16 17 18 20 21 22 23
19
output ground supply voltage (0 V)
MCD265 - 2
digital outputs D0 to D7
IN range
Fig.1 Block diagram; TDA8716.
1996 Aug 26
3
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PINNING TDA8716 SYMBOL CLK CLK VEED1 CPLT2 VEEA VRB AGND1 VI VRM VRT AGND2 VEED2 DGND1 D0 D1 D2 D3 D4 OGND D5 D6 D7 IR DGND2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 clock input digital negative supply voltage (-5.2 V) two's complement output select (active HIGH) analog negative supply voltage (-5.2 V) reference voltage BOTTOM analog ground 1 analog input reference voltage MIDDLE decoupling reference voltage TOP analog ground 2 digital negative supply voltage (-5.2 V) digital ground 1 digital output (LSB) digital output digital output digital output digital output output ground supply voltage (0 V) digital output digital output digital output (MSB) IN range digital ground 2
handbook, halfpage
TDA8716
DESCRIPTION complementary clock input
CLK CLK V EED1 C PLT2 V EEA VRB AGND1 VI VRM
1 2 3 4 5 6 TDA8716 7 8 9
24 DGND2 23 IR 22 D7 21 D6 20 D5 19 OGND 18 D4 17 D3 16 D2 15 D1 14 D0 13 DGND1
MCD259
VRT 10 AGND2 11 V EED2 12
Fig.2 Pin configuration; TDA8716.
1996 Aug 26
4
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PINNING TDA8716T SYMBOL CLK CLK VEED1 n.c. n.c. CPLT2 VEEA VRB AGND1 VI VRM n.c. n.c. VRT AGND2 VEED2 DGND1 D0 D1 n.c. n.c. D2 D3 D4 OGND D5 D6 n.c. n.c. D7 IR DGND2 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 clock input digital negative supply voltage (-5.2 V) not connected not connected two's complement output select (active HIGH) analog negative supply voltage (-5.2 V) reference voltage BOTTOM analog ground 1 analog input reference voltage MIDDLE decoupling not connected not connected reference voltage TOP analog ground 2 digital negative supply voltage (-5.2 V) digital ground 1 digital output (LSB) digital output not connected not connected digital output digital output digital output output ground supply voltage (0 V) digital output digital output not connected not connected digital output (MSB) IN range digital ground 2
handbook, halfpage
TDA8716
DESCRIPTION complementary clock input
CLK CLK V EED1 n.c. n.c. C PLT2 V EEA V RB AGND1 VI VRM n.c. n.c. V RT AGND2 V EED2
1 2 3 4 5 6 7 8 TDA8716T 9 10 11 12 13 14 15 16
MBC742 - 2
32 31 30 29 28 27 26 25 24 23 22
DGND2 IR D7 n.c. n.c. D6 D5 OGND D4 D3 D2
21 n.c. 20 19 n.c. D1
18 D0 17 DGND1
Fig.3 Pin configuration; TDA8716T.
1996 Aug 26
5
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VEEA VEED1,VEED2 VEEA - VEED1; VEEA - VEED2 VI VCLK; CLK(p-p) IO Tstg Tamb Tj Note PARAMETER analog supply voltage digital supply voltage supply voltage differences input voltage input voltage for differential clock drive (peak-to-peak value) output current (each output stage) storage temperature operating ambient temperature junction temperature referenced to AGND note 1 CONDITIONS MIN. -7.0 -7.0 -1 VEEA - - -55 0 -
TDA8716
MAX. +0.3 +0.3 +1 0 2.0 10 +150 +70 +150 V V V V V
UNIT
mA C C C
1. The circuit has two clock inputs: CLK and CLK. Sampling takes place on the rising edge of the clock input signal: CLK and CLK are two's complementary ECL signals. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT101 SOT287 (see Fig.4) HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. PARAMETER from junction to ambient CONDITIONS in free air 35 65 K/W K/W VALUE UNIT
1996 Aug 26
6
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
CHARACTERISTICS VEEA = -4.95 to -5.45 V; VEED1, VEED2 = -4.95 to -5.45 V; AGND, DGND and OGND shorted together; Tamb = 0 to +70 C; unless otherwise specified. (Typical values taken at VEEA = -5.2 V; VEED1, VEED2 = -5.2 V; Tamb = 25 C). SYMBOL Supply VEEA VEED1,VEED2 IEEA IEED1,IEED2 IEE Vdiff VRB VRT Vref VOB VOT VI(p-p) Iref RLAD TCRL Inputs CLK and CLK input VIL VIH IIL IIH RI CI VCLK(p-p) LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current input resistance input capacitance differential clock input VCLK - VCLK (peak-to-peak value) input current BOTTOM input current TOP input resistance input capacitance VRB = -3.13 V VRT = -1.87 V VCLK = -1.77 V VCLK = -0.88 V -1850 -960 - - - - - -1770 -880 1 10 20 2 900 -1650 -810 - - - - - mV mV A A k pF mV analog supply voltage digital supply voltage analog supply current digital supply current output supply current supply voltage differential RL = 2.2 k VEEA - VEED1; VEEA - VEED2 -5.45 -5.45 - - - -0.5 -3.5 - VRT - VRB note 1 note 1 - - - 0.95 - - - -5.2 -5.2 50 100 20 0 -3.13 -1.87 1.26 130 130 1.0 15 85 0.18 -4.95 -4.95 55 110 25 +0.5 - -1.5 - - - 1.5 - - - V V mA mA mA V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Reference voltages for the resistor ladder reference voltage BOTTOM reference voltage TOP reference voltage differential voltage offset BOTTOM voltage offset TOP input voltage amplitude (peak-to-peak value) reference current resistor ladder temperature coefficient of the resistor ladder V V V mV mV V mA /K
Analog input; note 2 IIB IIT RI CI - - - - 0 170 7 13 - - - 20 A A k pF
1996 Aug 26
7
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
SYMBOL Outputs (RL = 2.2 k)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Digital 10K ECL outputs (D0 to D7; IR) VOL VOH IOL IOH LOW level output voltage HIGH level output voltage LOW level output current HIGH level output current -1850 -960 - - - 4 note 3 CL = 3.3 pF CL = 7.5 pF taj fCLK; fCLK aperture jitter Switching characteristics maximum clock frequency 120 - - - - - - - note 4 Figs 13 and 14; note 5; fCLK = 100 MHz see Fig.10 see Fig.11 see Fig.12 fCLK = 100 MHz; fi = 10 MHz; Vi = 8 LSB at code 128; 50% clock duty factor - - - - - 7.7 7.5 7.0 6.5 10-11 - - - - - bits bits bits bits times/ samples - - - - - - - - 1 0.45 1.5 MHz - - - - - 15 7.5 9 - ns ns ps -1770 -880 1.8 2.0 -1600 -810 4.0 4.0 mV mV mA mA
Timing (fCLK = 100 MHz; RL = 2.2 k; see Fig.5) tds tHD td sampling delay output hold time output delay time 1 - 3 - ns ns
Analog signal processing (fCLK = 100 MHz) Gdiff diff f1 f2 f3 differential gain differential phase fundamental even harmonics odd harmonics note 4 note 4 0.3 0.4 0 -60 -50 0.5 0.25 1 % C dB dB dB
Harmonics (full scale); fi = 10 MHz; fCLK = 100 MHz
Transfer function ILE DLE AILE EB DC integral linearity error DC differential linearity error AC integral linearity error effective bits fi = 4.43 MHz fi = 10 MHz fi = 20 MHz fi = 30 MHz BER bit error rate LSB LSB LSB
1996 Aug 26
8
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
Notes
TDA8716
1. Voltage offset BOTTOM (VOB) is the difference between the analog input which produces data outputs equal to 00 and the reference voltage BOTTOM (VRB), at Tamb = 25 C. Voltage offset TOP (VOT) is the difference between reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at Tamb = 25 C. 2. The analog input is not internally biased. It should be externally biased between VRB and VRT levels. 3. The TDA8716 can only withstand one or two 10K or 100K ECL loads in order to work-out timings at the maximum sampling frequency. It is therefore recommended to minimize the printed-circuit board load by implementing the load device as close as possible to the TDA8716. 4. Full-scale sinewave; fi = 4.43 MHz; fCLK, fCLK = 100 MHz. 5. Effective bits are obtained via a Fast Fourier Transformer (FFT) treatment taking 4 K acquisition points per period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to SNR: SNR = EB (dB) x 6.02 + 1.76.
handbook, full pagewidth percent
0
MEA540
change (R th j-a) -10
-20
-30 SOL
-40
-50
-60 0 200 400 600 800 air flow (LFPM) 1000
Fig.4 Average effect of air flow on thermal resistance.
1996 Aug 26
9
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
Table 1 STEP Underflow 0 1 . . . 254 255 Overflow Output coding (CPLT2 HIGH) VI (TYP.) < -3 V -3 V . . . . . -2 V > -2 V BINARY OUTPUTS D7 to D0 00000000 00000000 00000001 ...... ...... ...... 11111110 11111111 11111111 IR 0 1 1 . . . 1 1 0 Table 2 CPLT2 1 (VIH) 0 (VIL) non inverted inverted Two's complement coding D7 (MSB)
TDA8716
handbook, full pagewidth
CLK
50 %
sample N ANALOG INPUT V l td DATA OUTPUT D0 - D7 DATA N-1
sample N + 1
sample N + 2
t HD
DATA N
DATA N+1
MSA654
50 %
Fig.5 Timing diagram.
1996 Aug 26
10
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
APPLICATION INFORMATION
TDA8716
Additional application information will be supplied upon request, please quote reference number FTV/AN 9109.
handbook, full pagewidth
CLK CLK VEED1 (- 5.2 V) C PLT2 V EEA (- 5.2 V) VRB (- 3.13 V)
1 2 3 4 5 6 100 nF 7 TDA8716
24 23 22 21 20 19 18 17 16 15 14 13 D4 D3 D2 D1 D0 D7 D6 D5
DGND2 IR
OGND (0 V)
AGND1 analog input VRM 100 nF VRT (- 1.87 V) 100 nF 11 AGND2 VEED2 (- 5.2 V) 12 DGND1
MCD260 - 2
8 9 10
V
EED
Typical value for resistors = 2.2 k. Lower resistor values can be used down to 500 to obtain higher sampling frequencies in the 150 MSPS range (limited by td and tHD timings). In this configuration a DC shift of the ECL output levels VOL and VOH will occur. VRB, VRT and VM are decoupled to AGND. Analog, digital and output supplies should be separated and decoupled. The external voltage regulator must be constructed in such a way that a good supply voltage ripple rejection is achieved with respect to the LSB value.
Fig.6 Application diagram; TDA8716.
1996 Aug 26
11
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
handbook, halfpage
DGND
13, 24
handbook, halfpage
AGND
7, 11
CLK; CLK
1, 2
VI
8
x 80
VCCD1
3
MCD261
VCCA
5
MCD262 - 1
handbook, halfpage
DGND
13, 24
handbook, halfpage
AGND
7, 11
VRT 4 VRM
10
C PLT2
9
resistor ladder
VCCD2
12
MCD263
VRB
6
VCCA
5
MCD264
handbook, halfpage
AGND
7, 11
VRT
10
VRM
9
resistor ladder
VRB
6
VCCA
5
MCD264
Fig.7 Internal pin configuration diagram.
1996 Aug 26
12
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
MEA537
handbook, full pagewidth
1.0 LSB 0.5
0
-0.5
-1.0 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 CODE 256
Fig.8 DC Integral Linearity Error (ILE).
MEA536
handbook, full pagewidth
1.0 LSB 0.5
0
-0.5
-1.0 0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240 CODE 256
Fig.9 DC Differential Linearity Error (DLE).
1996 Aug 26
13
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
0 amplitude (dB) -20
MEA535
-40
-60
-80
-100
-120 0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 frequency (MHz) 50.0
Effective bits: 7.74; Harmonic levels (in dB): 2nd = -69.34; 3rd = -58.85; 4th = -82.55; 5th = -68.16 and 6th = -63.01.
Fig.10 Fast fourier transformer (fCLK = 100 MHz; fi = 4.43 MHz).
1996 Aug 26
14
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
0 amplitude (dB) -20
MEA534
-40
-60
-80
-100
-120 0 6.25 12.5 18.7 25.0 31.2 37.5 43.7 frequency (MHz) 50.0
Effective bits: 7.57; Harmonic levels (in dB): 2nd = -82.07; 3rd = -61.90; 4th = -75.70; 5th = -65.61 and 6th = -72.50.
Fig.11 Fast fourier transformer (fCLK = 100 MHz; fi = 10 MHz).
1996 Aug 26
15
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
0 amplitude (dB) -20
MEA533
-40
-60
-80
-100
-120 0 6.43 12.9 19.3 25.7 32.2 38.6 45.0 frequency (MHz) Effective bits: 7.04; Harmonic levels (in dB): 2nd = -61.36; 3rd = -56.66; 4th = -61.97; 5th = -62.79 and 6th = -61.52. 51.5
Fig.12 Fast fourier transformer (fCLK = 100 MHz; fi = 20 MHz).
handbook, full pagewidth
MEA539
8 effective bits 7
6
5
4
0
5 4.43 MHz
10
15
20
25
30
35
40 f i (MHz)
Fig.13 Typical effective bit as a function of input signal at fCLK = 100 MHz.
1996 Aug 26
16
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
handbook, full pagewidth
8
MEA538
effective bits 7.5
7
6.5
6.0
0
10
20
30
40
50
60
70
80
90
100
110 120 f clock (MHz)
Fig.14 Typical effective bits as a function of clock frequency at fi = 10 MHz.
1996 Aug 26
17
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
PACKAGE OUTLINES DIP24: plastic dual in-line package; 24 leads (600 mil)
TDA8716
SOT101-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 24 13 MH wM (e 1)
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 32.0 31.4 1.26 1.24 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT101-1 REFERENCES IEC 051G02 JEDEC MO-015AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-23
1996 Aug 26
18
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8716
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A X
c y HE vM A
Z 32 17
Q A2 A1 pin 1 index Lp 1 e bp 16 wM L detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 0.02 0.01 c 0.27 0.18 0.011 0.007 D (1) 20.7 20.3 0.81 0.80 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.2 1.0 0.047 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.95 0.55 0.037 0.022
0.012 0.096 0.004 0.086
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT287-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-25
1996 Aug 26
19
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8716
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Aug 26
20
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8716
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Aug 26
21

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